Black Aluminum Nitride Porcelain Ceramic Substrate with High Thermal Conductivity Strong Bonding Strength and High Insulation

PRODUCT DETAIL
model:3741Plate thickness:0.127mm-3mm
minute. Line spacing:0.05mmminute. Line width:0.05mm
Board size:otherBase material:aluminum nitride
minute. Hole size:0.06mmSurface treatment:Spray tin, immersion gold
Copper thickness:0.5 micron-5mmPlace of origin:Guangdong Province, China (Mainland)
type:Ceramic PCBpayment terms:L/C, Western Union, D/P, D/A, T/T, MoneyGram
brand:Zhanzhi
Product parameters

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Product parameters
Material Alumina, aluminum nitride, silicon nitride and other ceramic materials, silicon carbide, sapphire, glass and other transparent wafer materials
Plate thickness 0.127mm-3mm, support customization
Number of layers Single layer, single side, single and double sided
Copper thickness 0.5μm-5mm
surface metal layer Titanium, copper, nickel, silver, gold, palladium, tin, platinum, tungsten, etc.
Product Description

 

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