Fully automatic wire bonding ball bonding machine MD-S800 wire bonding machine wire bonding machine

PRODUCT DETAIL
Video outbound inspection:ifCore component warranty:1 year
Core components:PLCbrand:Mingde Hi-tech Company
model:MD-S800Supply capacity:100 sets per month
Marketing type:Hot Products of 2022Health status:new
port:Guangzhou/Shenzhen/Hong KongMechanical test report:if
payment terms:L/C, Western Union, D/P, D/A, T/T, MoneyGramWarranty:1 year
Packaging details:wire bonding machinePlace of origin:Guangdong, China
Showroom location:Canada, Turkey, United Kingdom, United States, France, Germany, Vietnam, Indonesia, India, Russia, South Korea, MalaysiaWeight (kg):800
Product Description
Automatic wire ball bonding machine MD-S800
Specification
1. Technical specifications

XY platform travel:
XY stroke: 65*70 mm
XY platform accuracy: 0.04 mil (1um)
Z bonding travel: 9.0 mm
Image recognition system and optical system
Image recognition method: 256 grayscale, can identify R/G/B and frosted chips
Resolution: 640*480
Optical magnification: 2~4, adjustable
Image recognition accuracy: ±0.37um
Ultrasonic generators and transducers
Ultrasonic generator: UTHE 10H-P2
Ultrasonic transducer: UTHE 70PT
Temperature controller: Omron E5CSL
User interface: Windows xp system, Chinese and English
Program memory size: 1000
Minimum gold wire: 0.5 million
speed
Bonding cycle: 70ms/2mm line
Unit per hour: 28K (single line), 15K (double line)
working conditions
Voltage/frequency: AC220V/50-60Hz
Compressed air: ≥0.3~0.5 Bar
Rated power: 1200W
Air consumption: 80 LMP
Weight and dimensions
Weight: 800kg
Size: 1230mm*940*1660
detail
sample
Customer use
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