12" Precision Automatic Grinding/Polishing Machine with Two 4" Semiconductor Wafers and Ceramic EQ-Unipol-1202 Workstation

PRODUCT DETAIL
Weight (kg):75Showroom location:not any
Packaging Details:Standard export packagingLocal service location:not any
Power (kW):1product name:12" Precision Automatic Grinding/Polishing Machine
Origin:Henan, Chinapayment terms:L/C, T/T, Western Union, MoneyGram
Health status:newport:Chinese port
Supply capacity:300 sets per monthAfter warranty service:online support, spare parts
brand:TCHAfter-sales service provided:On-site installation, commissioning and training, on-site maintenance and repair services, online support, free spare parts, video technical support
Warranty:1 yearMain selling points:Sustainable
Applicable industries:Precision grinding machine

12" Precision Automatic Grinding/Polishing Machine with Two 4" Semiconductor Wafers and Ceramic EQ-Unipol-1202 Workstation

Product Description

 UNIPOL-1202The machine is equipped with a 12" ultra-flat grinding disc, which can be used as a high-precision grinding machine for polishing crystal components, semiconductor wafers and ceramic substrates up to4" diameter. It can also be used as a standard grinding and polishing machine for metallographic sample preparation.

 

Specifications for 12" Precision Automatic Grinding/Polishing Machine with Two 4" Semiconductor Wafers and Ceramic EQ-Unipol-1202 Workstation

strength

AC 110V and 208-240V (50/60Hz) switchable worldwide.

feature
  • One cast iron plate for grinding and one cast aluminum plate for polishing.
  • Two rocking stations with wafer holders and conditioning rings that can be independently controlled to simultaneously polish 2 pieces of 4" wafers.
  • Includes complete accessories ready for immediate use
Extra Flat 12" (300 mm) Diameter Grinding Disc Flatness < 0.25 µm/in²
Precision Rotary Shaft Bleed < 5 microns
Heavy-duty cast aluminum housing with varnish Color: black or white
Two workstations with 8° swing and adjustable speed 8" swing, 0-9 swings/minute adjustable
Two flat sample holders for carrying < 4" diameter wafers Diameter 105 x 35 mm
two condition rings 120 OD x 110 ID x 32 T mm
Digital display main disc speed change 0 ~ 125 rpm
Adjustable timer with automatic stop 0 - 99 hours
engine 300 W high torque DC motor
aspect 700 L x 475 W x 300 H (mm)
weight 154 lbs
Optional automatic slurry feeder Automatic slurry feeder SKZD-2 is not included.
The plastic rolling container holds up to 1.0 gallons (~3.8 L) of slurry for extended polishing.
Shipping size 40"x30"x26"
Shipping weight 245 lbs

optional parts
  • 2" Polishing Fixture for Precision/Automated Thinning and Polishing
obey
  • CE certification
  • NRTL certification is temporarily unavailable.

Warranty
  • One year limited, lifetime support
  • Rust and damage caused by improper storage conditions or maintenance are not covered by the warranty

 

Reference for 12" Precision Automatic Grinding/Polishing Machine with Two 4" Semiconductor Wafers and Ceramic EQ-Unipol-1202 Workstation

 

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